Industry Information

Industry Information
Introduction to the Coefficient of Thermal Expansion of Aluminum-Silicon Alloys
04-09 / 2024

Introduction to the Coefficient of Thermal Expansion of Aluminum-Silicon Alloys

When we talk about the coefficient of thermal expansion of aluminum-silicon alloys, we're essentially discussing the degree of volume change of the material with temperature variations. The coefficient of thermal expansion is typically described in terms of the change in volume per degree Celsius (or per Kelvin) of temperature change, indicating the material's expansion or contraction rate. Aluminum-silico
Introducing AlSi50 - an aluminum-silicon alloy with outstanding performance and multiple advantages!
01-30 / 2024

Introducing AlSi50 - an aluminum-silicon alloy with outstanding performance and multiple advantages!

Introducing AlSi50 - an aluminum-silicon alloy with outstanding performance and multiple advantages! Low Coefficient of Thermal Expansion (CTE) - AlSi50 stands out with its low coefficient of thermal expansion, offering infinite possibilities for innovation in various industries. Whether in aerospace or electronic device manufacturing, AlSi50 is a symbol of stability. Lightweight Efficiency - The low density of th
Aluminum Industry Weekly News Review (10.16-10.20)
10-24 / 2023

Aluminum Industry Weekly News Review (10.16-10.20)

In September, China imported 10.02 million tons of aluminum ore and its concentrates, according to the data from the General Administration of Customs. This marked a 23.1% year-on-year increase. From January to September, the cumulative import of aluminum ore and its concentrates reached 106.64 million tons, a 12.8% year-on-year increase. In September, China exported 90,000 tons of alumina, a 0.3% decrease compared t
Hybrid Integrated Circuit
09-01 / 2023

Hybrid Integrated Circuit

A hybrid integrated circuit, HIC, hybrid microcircuit, or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices (e.g. transistors and diodes) and passive components (e.g. resistors, inductors, transformers, and capacitors), bonded to a substrate or printed circuit board (PCB). If the com
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