Name: Multilayer Circuit Package
Brand: GETM
Availability: InStock
Rating: 5 (35 reviews)

Multilayer Circuit Package

Material: Al-Si Alloys

Zuoyuan adopts rapid solidification and subsequent machining technology, offering a series of electronic packaging services,including R&D,production,subsequent machining and plating.

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Product Details

Product Description

» Surface Mount Device

Selectable Silicon Aluminum(Si/Al) Alloys

» AlSi70(Si-30%Al controlled expansion alloy)

Advantages

»  Low density;
»  High thermal conductivity and excellent heat dissipation;
»  Adopts precision etching,devices have small tolerance and high precision;
»  Ease of manufacture,platability and weldability.

AlSi Alloys Performance Parameters

Content wt%	Density g/cm³	CTE 25℃ ppm/℃	Thermal Conductivity 25℃ W/mK	Tensile Strength MPa	Yield Strength MPa	Poisson's Ratio	Elongation %	Elastic Modulus GPa
Al-20%Si	2.40	6	110	125	125	--	--	132
Al-27%Si	2.6	17	175	170	130	0.29	3.8	91
Al-30%Si	2.43	7.5	120	138	138	0.25	＜1	131
Si-40%Al	2.46	9	125	181	181	0.27	＜1	121
Si-42%Al	2.55	13.5	143	200	187	0.29	1	105
Si-50%Al	2.5	11.5	140	200	210	0.28	＜1	108

Grade	Density g/cm³	CTE ppm/℃	Thermal Conductivity W/mK	Tensile Strength MPa	Yield Strength MPa	Poisson's Ratio	Elongation %	Elastic Modulus GPa
ZY-4047	2.66	21.6	193	208	129	0.33	18	70
ZY-6061	2.7	22.6	210	312	270	0.33	12.5	69

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